| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a curable resin composition which enables its coating at ordinary temperature without using a viscosity depressant such as wax and a cured product of which has high surface hardness and exhibits hot-melt property. <P>SOLUTION: This curable resin composition excellent in hot-melt property comprises a component (A); a heat-adhesive polymer, a component (B); an ethylenically unsaturated compound polymerizable with an active energy beam and a component (C); a polymerization initiator. When ( A<SB>wt</SB>compont A weight) and ( B<SB>wt</SB>) denote the blending quantity in pts. mass of the components (A) and (B), respectively, these ( A<SB>wt</SB>) and ( B<SB>wt</SB>) satisfy the following formulae; 0.1≤( A<SB>wt</SB>)/ä( A<SB>wt</SB>) + ( B<SB>wt</SB>)}≤0.6 and 0.4≤( B<SB>wt</SB>)/ä( A<SB>wt</SB>) + ( B<SB>wt</SB>)}≤0.9. <P>COPYRIGHT: (C)2004,JPO</p> |
