| 发明名称 |
SOLDER RESIST COMPOSITION, DRY FILM, AND METHOD FOR FORMING RESIST PATTERN |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist composition having excellent tackiness after predrying and a dry film for solder resist having the excellent following properties of the solder resist to the rugged parts of conductive circuits. <P>SOLUTION: The solder resist composition containing a resist pattern gelation, the dry film provided with the solder resist composition on a carrier film and the method of making resist patterns by using the same are provided. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004004263(A) |
申请公布日期 |
2004.01.08 |
| 申请号 |
JP20020159302 |
申请日期 |
2002.05.31 |
| 申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
IRISAWA MUNETOSHI;HYODO KENJI |
| 分类号 |
G03F7/004;H05K3/28 |
主分类号 |
G03F7/004 |
| 代理机构 |
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