发明名称 ELECTRICAL BONDING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To ensure a sure connection despite of the thickness of electrical bonding parts to be bonded with each other. SOLUTION: In an electrical bonding structure where electrical bonding parts having tabular main surfaces 2a, 4a are bonded with each other, part of the main surface 2a of one electrical bonding part 2 is bumped (cutted out) to form a bump (a projection piece) 5 and an abutting part (a notch) 7 is arranged in the main surface 4a of the other electrical bonding part 4. After the main surfaces of the two electrical bonding parts are superposed with each other and the bump and the abutting part are engaged, the bump is dissolved to bond the bump with the abutting part, thus bonding the two electrical bonding parts with each other. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004006547(A) 申请公布日期 2004.01.08
申请号 JP20020160977 申请日期 2002.06.03
申请人 KOITO MFG CO LTD 发明人 AZUMA YUJI;SUGIURA NAOKI;FUJIMURA HIRONORI
分类号 H05K7/06;(IPC1-7):H05K7/06 主分类号 H05K7/06
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