发明名称 METHOD AND APPARATUS FOR ELECTRO-CHEMICAL PROCESSING
摘要 A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc and a second thickness is deposited on the substrate. During the deposition, the partial enclosure and the substrate are rotated relative one another.
申请公布号 US2004003894(A1) 申请公布日期 2004.01.08
申请号 US20000739139 申请日期 2000.12.18
申请人 APPLIED MATERIALS, INC. 发明人 HSU WEI-YUNG;CHEN LIANG-YUH;MORAD RATSON;CARL DANIEL A.;SOMEKH SASSON
分类号 B24B37/00;B24B37/04;C25D5/00;C25D5/22;C25D7/12;H01L21/288;H01L21/304;H01L21/321;H01L21/768;(IPC1-7):C23F1/00 主分类号 B24B37/00
代理机构 代理人
主权项
地址