ELECTRONIC COMPONENT WITH A HOUSING PACKAGING

摘要

The invention relates to an electronic component with a housing packaging (2) consisting of several plastic layers (3) with at least one buried strip-conductor layer (4) and at least one semiconductor chip (5) which has outer pointed-cone-shaped contacts (7) which are disposed on an outer side (6) thereof. One of the plastic layers (3) is pierced by the pointed-cone-shaped outer contacts (7) which form through-contacts leading to the buried strip-conductor layer. The invention also relates to a method for the production of one such electronic component (1).