| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit in which the property of a decoupling capacitor is changed even after a semiconductor package is manufactured, in the semiconductor integrated circuit which has a semiconductor package, in which a plurality of electrode pads are arrayed on a bottom surface, and a decoupling capacitor. SOLUTION: The semiconductor integrated circuit 1 is provided with an LSI package 2. A plurality of connection via lines 10 for power supply wiring and connection via lines 11 for ground wiring are provided to a center part of a bottom surface 2a of the LSI package 2. The decoupling capacitor 6, comprising a power supply plane 13 and a ground plane 14, is provided outside the LSI package 2. The connection via lines 10 for power supply wiring and the connection via lines 11 for ground wiring are arranged into a matrix shape so that they are adjacent to each other. The connection via line 11 for ground wiring is inserted through an opening part 13a of the power supply plane 13. An electrode pad 3 for power supply is inserted through an opening 14a of the ground plane 14. COPYRIGHT: (C)2004,JPO
|
