| 摘要 |
PROBLEM TO BE SOLVED: To provide a COF type film carrier tape which prevents an insulator layer from thermally fusing into a heating tool or a stage, and thus enhances reliability and productivity of an IC chip mounting line. SOLUTION: The COF type film carrier tape is provided with the insulator layer 12 and wiring patterns 21 which are obtained by patterning a conductor layer that has been stacked on one side of the insulator layer 12. Each of the wiring patterns 21 is provided with an inner lead 21a which is joined to a golden bump of an electronic part. In an area of the insulator layer 12, where the inner lead 21a is provided, a thin thickness portion 25 which is relatively thinner than other areas is provided. COPYRIGHT: (C)2004,JPO
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