| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flowability and in the balance between curability and reflow crack resistance in moisture absorption; and an electronic part device having an element sealed with the resin composition and excellent in reliability. SOLUTION: This epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) a cure accelerator which contains (D) an adduct of a phosphine compound having at least one alkyl group bonded to the phosphor atom and a quinone compound and (E) an adduct of a triarylphosphine and a quinone compound. The electronic part device has an element sealed with the resin composition. COPYRIGHT: (C)2004,JPO
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