| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a basic metallurgical solution for reliability of connection between solder and a metal and in the mechanical heat stress. <P>SOLUTION: An integrated circuit chip 501 has a plurality of conductor pads connected to an external component by reflow connection 510. The chip has an NiTi alloy coating layer 505 on each pad. The alloy comprises a composition and crystalline structure that function by reversible phase transitions under the thermo mechanical stress. Consequently, mechanical distortions are absorbed by an alloy layer. Preferably, the alloy comprises 0-56.0 wt.% of Ni and 0-45.0 wt.% of Ti, and has a thickness of 0.3-6.0 μm. After coating, the alloy is recrystallized at 450-600°C for 4-6 minutes. A brazeable metal layer 506 works as a diffusion barrier after reflow installation. <P>COPYRIGHT: (C)2004,JPO |
