MANUFACTURING METHOD OF SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To provide a grinding technique to smooth out fine irregularities on the side face of a silicon block in a short time, thus improving the crack yield of a silicon wafer.

SOLUTION: The technique solves the foregoing task by employing a silicon wafer manufacturing method comprising mechanically grinding and slicing the side face of a silicon block for manufacturing a silicon wafer.

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