| 发明名称 |
SEMICONDUCTOR MANUFACTURING EQUIPMENT, POLISHING SOLUTION SUPPLY ARRANGEMENT, PROPERTY DETECTING METHOD OF POLISHING SOLUTION, AND MANUFACTURE OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To continuously maintain successful polishing properties by detecting variations in the polishing characteristics of a polishing solution. <P>SOLUTION: Equipment for manufacturing a semiconductor device by polishing the surface of a semiconductor substrate comprises a polishing pad for polishing the substrate surface; a polishing solution supply means for supplying the polishing solution to the substrate surface; and a measuring instrument 18 including an electrode (A) 24 and an electrode (B) 25 dipped into the polishing solution 22. The measuring instrument 18 detects variations in the characteristics of the polishing solution 22 from the variations in the value of current flowing between the electrode (A) 24 and the electrode (B) 25 or the potential difference between the electrodes. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004006499(A) |
申请公布日期 |
2004.01.08 |
| 申请号 |
JP20020159641 |
申请日期 |
2002.05.31 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
SAKAI KATSUNAO |
| 分类号 |
B24B37/00;B24B49/10;B24B57/02;H01L21/304;H01L21/3205;H01L21/321;H01L21/768;H01L21/822;H01L27/04;(IPC1-7):H01L21/304;H01L21/320 |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
