POLISHING PAD OF CHEMICAL MECHANICAL POLISHING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a detector and a method for an endpoint that improves fidelity regarding a polishing process and further can be used for giving useful information.

SOLUTION: Uniformity in layers on a substrate 14 is measured in situ during the polishing of the layer concerned. This method comprises a step for directing laser beams 34 toward a layer during polishing; a step for monitoring interference signals generated due to the reflection of the beams 34 from a substrate 14; and a step for calculating a homogeneous measure from the interference signals.

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