SMD GLASS PACKAGE AND ELECTRONIC ELEMENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a surface mount device and a glass package therefor, which realize much lower cost while satisfying the request for downsizing and high performance. SOLUTION: The glass package, which has been formed by a melting and pressing method, has a linear expansion coefficient suitable for the metal for constituting an SMD terminal, in a temperature range that realizes anode bonding, and comprises alkaline components of more than a given amount. The alkaline components includes Na2O and Li2O. COPYRIGHT: (C)2004,JPO