发明名称 |
Method and apparatus for endpoint detection |
摘要 |
This invention relates to methods of detecting a planarization endpoint in chemical mechanical planarization of a substrate wherein a detectable target is located at the endpoint and then detected during the CMP planarization. The invention also relates to layered substrates that contain a detectable target located between a first layer of material and a second layer of material. The invention also relates to methods of chemical mechanical planarization of a substrate.
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申请公布号 |
US2004005769(A1) |
申请公布日期 |
2004.01.08 |
申请号 |
US20020190243 |
申请日期 |
2002.07.03 |
申请人 |
CABOT MICROELECTRONICS CORP. |
发明人 |
MIKOLAS DAVID G. |
分类号 |
B24B37/04;B24B49/04;G02B6/12;H01L21/3105;(IPC1-7):H01L21/44;H01L21/302;H01L21/461 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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