| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an etching process for making a hole directly in the outer layer copper foil of a copper clad multilayer board using carbon dioxide gas laser under a state where blackoxide plating, a metal layer of different kind and a coating of organic material are not present. <P>SOLUTION: A through hole, e.g. an IVH or a BVH, or a hole is made in a copper clad multilayer board 2 produced by cladding basic material resin with a copper foil, and then it is subjected to interlayer conduction processing, exposure, development, and circuit etching and a circuit is formed by removing etching resist. In such a method for producing a printed wiring board, the copper clad multilayer board 2 has a high carbon content copper layer 6 containing carbon by 0.08-0.40 wt.% formed on the surface 5 of a copper foil located on the outer layer thereof. <P>COPYRIGHT: (C)2004,JPO</p> |
