| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be stacked to use, and a semiconductor module using it. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 101 in which an integrated circuit provided with a plurality of external terminals 104 is formed on a principal surface, and a tape 108 comprising a structure in which a conductive layer 110 is sandwiched between insulating layers 109 and 113. The principal surface of the semiconductor chip 101 is covered with a passivation film 105. The tape 108 extends from the principal surface of the semiconductor chip 101 to the rear surface of it. Further, the tape is stuck to the semiconductor chip 101 on the principal surface side and the rear surface side of the semiconductor chip 101, respectively. The conductive layer 110 is electrically connected to a plurality of the external terminals 104, and exposed from openings 103a and 103b formed in the insulating layer 113 positioned on each of the principal surface and the rear surface of the semiconductor chip 101. <P>COPYRIGHT: (C)2004,JPO |
