WIRING TRANSFER SHEET AND ITS MANUFACTURING METHOD, AND WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board having surface planarity suitable for mounting a semiconductor bare chip and an electronic part or the like as a whole and a surface structure for satisfactorily adhering materials laminated on the wiring board microscopically. SOLUTION: A wiring transfer sheet having a base material and a wiring layer formed on its surface is formed so that the wiring layer has two or more recesses where the base material exposes to the surface. When the wiring layer is transferred to the electric insulating base material by using the wiring transfer sheet, convex parts of shapes complementary to those of the recesses are formed on the exposed surface of the electric insulating base material of the wiring board, and the convex parts are configured to improve the adhesion of the resin laminated on the surface of the wiring board with the wiring board. COPYRIGHT: (C)2004,JPO