发明名称 WIRE SAW FOR CUTTING WAFER FROM WORKPIECE, AND METHOD FOR CUTTING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multi-wire saw which has a bearing device with an improved wire guide roller. SOLUTION: The wire saw 1 is guided around the wire guide rollers 3 in multiple layers, and functions to cut a wafer from a workpiece. The wire guide rollers each have the rotatable bearing device 15, and the two adjacent wire guide rollers restrict a saw frame 14. Herein, the wire saw of this type has ceramic plain bearings 16, 17 for the rotative bearing of the wire guide rollers. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004001175(A) 申请公布日期 2004.01.08
申请号 JP20030022750 申请日期 2003.01.30
申请人 WACKER CHEMIE GMBH 发明人 LUKSCHANDEL JOERG;KRACKER JOSEF
分类号 B24B27/06;B23D57/00;B23Q1/38;B28D5/04;F16C17/02;(IPC1-7):B24B27/06 主分类号 B24B27/06
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