| 发明名称 |
Polymeric compound and resin composition for photoresist |
| 摘要 |
A photoresist polymeric compound includes a monomer unit represented by following Formula (I): The polymeric compound may further include at least one of monomer units represented by Formulae (IIa) to (IIg) as described in the specification. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.
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| 申请公布号 |
US2004006189(A1) |
申请公布日期 |
2004.01.08 |
| 申请号 |
US20030375129 |
申请日期 |
2003.02.28 |
| 申请人 |
DAICEL CHEMICAL INDUSTRIES, LTD. |
发明人 |
FUNAKI YOSHINORI;TSUTSUMI KIYOHARU;TAKARAGI AKIRA |
| 分类号 |
H01L21/027;C08F18/00;C08F20/10;C08F22/06;C08F32/00;C08F32/08;C08F232/02;G03F7/004;G03F7/039;(IPC1-7):C08F122/04 |
主分类号 |
H01L21/027 |
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