发明名称 |
WEARABLE SILICON CHIP |
摘要 |
A semiconductor chip package and method of providing same including a semiconductor die, an insulating package body encapsulating the semiconductor die, and an aperture extending through and between opposing sides of the package body, wherein at least a portion of an inner surface of the aperture is electrically connected to the semiconductor die. The chip package can be attached to an article or clothing using conducting thread. |
申请公布号 |
WO2004003999(A1) |
申请公布日期 |
2004.01.08 |
申请号 |
WO2003IB02557 |
申请日期 |
2003.06.06 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;U.S. PHILIPS CORPORATION |
发明人 |
MARMAROPOULOS, GEORGE;VAN HEERDEN, CLIVE |
分类号 |
H01L23/08;A41D1/00;H01L23/31 |
主分类号 |
H01L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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