| 摘要 |
PROBLEM TO BE SOLVED: To provide an alloy for low melting point to improve a bonded layer, enable the bonding at a low temperature, and improve a bonding strength by optimizing an alloy composition of a bonding material. SOLUTION: This alloy has a composition consisting of, by atom %, 6-14% B, < 2% Si, 2-6% C, and 1-20% P, and the balance Fe with inevitable impurities, with the melting point thereof being≤1,100°C. The alloy further contains at least one kind of 0.1-20% Ni, 0.1-20% Cr, and 0.1-10% V. Since the material of a bonded layer is improved and the melting point is dropped, the bonding strength exceeding 1.0 in terms of the bonding strength of a base metal is consistently obtained. Thus, the bonding does not impair any characteristic of a work to be bonded. In addition, a bonding cost is reduced by dropping a heating temperature. COPYRIGHT: (C)2004,JPO
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