发明名称 FIXTURE FOR HOLDING SUBSTRATE, AND TREATMENT APPARATUS FOR SUBSTRATE SURFACE
摘要 PROBLEM TO BE SOLVED: To provide a fixture for holding a substrate wherein the surface treatment for a substrate is possible without changing the internal configuration of a vertical furnace, and the quality of the surface treated substrate is made uniform. SOLUTION: The apparatus comprises a holding member 52 for holding a substrate 53 by permitting the substrate 53 to fit to a groove 57, and a bottom plate 55 and a top plate 56 provided at the opposite ends of each holding member 52, and formed into an outer diameter and an external configuration in response to the internal configuration of a vertical furnace. Since the configurations of the bottom plate 55 and the top plate 56 are determined in response to the configuration of the substrate holding member 52, even when the substrate holding member 52 is inserted into the furnace, the speed of the gas flowing in the furnace, and the flow rate and the flow rate ratio of the same, etc., can be made the same irrespective of the size of the substrate. Hereby, the quality of the surface treated substrate can be made uniform without changing the internal configuration of the furnace. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004006508(A) 申请公布日期 2004.01.08
申请号 JP20020159826 申请日期 2002.05.31
申请人 SHARP CORP 发明人 HIRAIWA AKITO
分类号 C23C16/458;H01L21/205;H01L21/22;H01L21/68;H01L21/683;(IPC1-7):H01L21/205 主分类号 C23C16/458
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