发明名称 |
METHOD OF FORMING ZINC OXIDE SEMICONDUCTOR LAYER, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide methods of forming a ZnO semiconductor layer with excellent crystallinity and manufacturing a semiconductor device having the ZnO semiconductor layer with excellent crystallinity at low cost. <P>SOLUTION: A sputtering method is used to form a ZnO buffer layer 2 with conductivity of ≤1×10<SP>-10</SP>S/cm or a ZnO buffer layer 2 having a peak (e.g. (103) or (112)) other than (002) and (004) at a diffraction peak of a crystal surface by an X-ray diffracting method on a substrate 1 and then form a ZnO semiconductor layer 3 on the ZnO buffer layer 2. Here, the ZnO semiconductor layer 3 is formed in such a manner that the oxygen gas flow rate in a sputter gas is smaller than that during the formation of the ZnO buffer layer 2. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004006686(A) |
申请公布日期 |
2004.01.08 |
申请号 |
JP20030058611 |
申请日期 |
2003.03.05 |
申请人 |
SANYO ELECTRIC CO LTD |
发明人 |
TAKEDA KATSUTOSHI;ISOMURA MASAO |
分类号 |
C23C14/34;H01C7/10;H01L21/363;H01L29/786;H01L33/12;H01L33/28;H01L33/40 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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