| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition system which hardly exert effect upon the environment, and realize a low cost and a high yield. SOLUTION: A reflection film is deposited on an object for film deposition in a treatment chamber by sputtering. Thereafter, gaseous oxygen, nitrogen or halogen is fed to the same treatment chamber from a reaction gas feeding apparatus. The surface of the reflection film is then exposed to the gaseous oxygen, nitrogen or halogen, so that an oxide film, a nitride film or a halogenated film of the reflection film material is deposited on the surface of the reflection film. Reactive sputtering can be carried out by performing sputtering together with the feed of the gas from the reaction gas feeding apparatus. COPYRIGHT: (C)2004,JPO
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