发明名称 Semiconductor device and manufacturing method thereof
摘要 The semiconductor device includes a plurality of transistors, wherein one of the transistors that has the thinnest gate dielectric layer is selected to serve as a power source protection element, among a plurality of transistors, each having a gate dielectric layer of an independently set film thickness, disposed on a same substrate to be operated by a voltage from a same power source. Also, a threshold voltage of the transistor selected as the power source protection element is set higher than other transistor that also has the thinnest gate dielectric layer.
申请公布号 US2004004229(A1) 申请公布日期 2004.01.08
申请号 US20030606836 申请日期 2003.06.27
申请人 NEC ELECTRONICS CORPORATION 发明人 AKIYAMA NAOTO
分类号 H01L27/04;H01L21/822;H01L21/8234;H01L21/8244;H01L27/06;H01L27/088;H01L27/10;H01L27/105;H01L27/11;(IPC1-7):H01L29/74;H01L31/111;H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L27/04
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