INKING APPARATUS WITH MULTI-POSITIONING CAPABILITY

摘要

An inking apparatus including an inking head which is manually adjustable in the X, Y and Z directions to facilitate quick and easy positioning of an inking probe in proximity to a defective die on a semiconductor wafer to ink and mark the die for exclusion from further processing. A horizontal positioning plate is horizontally adjustably mounted on a base plate, and an angular adjustment arm is angularly adjustably mounted on the horizontal positioning plate. The inking head is vertically adjustably mounted on the end of the angular adjustment arm and carries an ink reservoir from which ink is dispensed through an inking probe to the dies on the wafer.