SOCKETLESS PACKAGE TO CIRCUIT BOARD ASSEMBLIES AND METHODS OF USING SAME

摘要

A readily demountable socketless package to circuit board assembly (200) is disclosed. The assembly (200) includes a soft solder area (212) and a metallic contact element (208), each located on copper pads (214, 210). The metallic contact element (208) is adapted to sufficiently penetrate the soft solder area (212) to provide electrical contact. The metallic contact element (208) can be either a sharp metallic element or a spring. Compressive force from a clamping mechanism ensures a secure electrical contact and adequate thermal performance.