| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily provide an system LSI by employing a semiconductor device in which a plurality of LSI chips are sealed in a resin. <P>SOLUTION: A pad electrode 15 for connection to a lead 9 and a pad electrode 125 for an internal interface are provided on the main surfaces of an LSI chip 103.The pad electrodes 115 and 125 of the LSI chips 113 arranged on the main surface are electrically connected together with a wire 117. Thus part of such circuit as required as an system LSI, which is not provided by the LSI chip 103, is mounted on the LSI chip 113, to realize a wanted function as a system LSI using two LSI chips. <P>COPYRIGHT: (C)2004,JPO</p> |
