| 摘要 |
PROBLEM TO BE SOLVED: To provide an arrangement wherein the density of contaminated particles is reduced so as to be smaller in a spatial unit, more sensitive in relation to the contaminated particles between two sets of the spatial unit in a processing apparatus for manufacturing a semiconductor. SOLUTION: The first spatial unit 21 and the second spatial unit 22, in which the density of contaminated particles is reduced compared with the ambients thereof, respectively, are provided while a first laminar flow 41 having a first flow rate and a second laminar flow 42 having a second flow rate are parallel in relation to each other. The first spatial unit 21 is connected to the second spatial unit 22 by a third spatial unit 23 so as to transport a semiconductor disk while a third laminar flow 43 having a third flow rate is orthogonal to the first laminar flow 41 and the second laminar flow 42. COPYRIGHT: (C)2004,JPO |
