| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulating case for an electronic device whose costs can be reduced by decreasing the number of parts and assembly hours, and which realizes vibration isolation and slip prevention. SOLUTION: The encapsulating case for an electronic device is molded by two-color molding of a hard resin A and a soft resin B in one body into an unfolding figure. The encapsulating case is formed into a case form by molding the folding parts (thin wall parts) 6, 14 of this encapsulating case of this unfolding figure out of only the soft resin B, and folding the encapsulating case 1 of the unfolding figure along the thin wall parts 6, 14 after the encapsulating case 1 has been built in the electronic device in the unfolded state. Moreover, a rib 18 is formed out of the soft resin in the peripheral part of the bottom part 2 of the encapsulating case, and this rib 18 has the effects of slip prevention and vibration isolation when the encapsulating case 1 is mounted on a table or the like. COPYRIGHT: (C)2004,JPO
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