| 摘要 |
PROBLEM TO BE SOLVED: To provide an alloy for low melting point bonding to enable the bonding at a lower temperature and improve the bonding strength by optimizing the alloy composition of a bonding material. SOLUTION: This alloy has a composition consisting of, by atom %, 6-14% B, 2-3.5% Si, 0.2-4% C, and 1-20% P, and the balance Fe with inevitable impurities, with the melting point thereof being≤1,100°C. The alloy further contains at least one kind of 0.1-20% Ni, 0.1-20% Cr, and 0.1-10% V. Since the melting point is≤1,100°C, the bonding at a lower temperature is possible, and the bonding strength exceeding 0.9 compared with a base metal is consistently obtained. Thus, the bonding does not impair any characteristic of a work to be bonded. In addition, a bonding cost is reduced by dropping a heating temperature. COPYRIGHT: (C)2004,JPO
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