| 摘要 |
PURPOSE: A platen apparatus for a CMP(Chemical Mechanical Polishing) process is provided to be capable of preventing chemicals from being mixed with each other and remaining at the inner portion of a platen by improving the structure of the platen apparatus. CONSTITUTION: A platen apparatus for a CMP process is provided with a source supply line for transmitting the chemicals supplied through a pump and a main chemical supply line(6) for transmitting the chemicals transmitted from the source supply line to the inner portion of a platen(5). The platen apparatus further includes a plurality of sub-chemical supply lines(7) for exhausting the chemicals supplied through the main chemical supply line connected to the inner portion of the platen, to the outside of the platen through a plurality of chemical supply holes.
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