PROCESS FOR MACHINING THIN SILICON WAFER

摘要

PURPOSE: To provide a process for machining a single crystal wafer into a thin silicon wafer 1 in which cracking, or the like, starting from the tapered peripheral can be prevented while facilitating handling of the silicon wafer. CONSTITUTION: A plurality of silicon wafers 1 having a bevel 2 at the peripheral part are stacked and the bevels 2 at the peripheral part are ground collectively. Subsequently, the surface of individual silicon wafers is back ground to produce a thin silicon wafer 10.