发明名称 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits
摘要 A new method of provided for forming in one plane layers of semiconductor material having both high and low dielectric constants. Layers, having selected and preferably non-identical parameters of dielectric constants, are successively deposited interspersed with layers of etch stop material. The layers can be etched, creating openings there-through that can be filled with a a layer of choice.
申请公布号 US2004004054(A1) 申请公布日期 2004.01.08
申请号 US20020189876 申请日期 2002.07.05
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD. 发明人 PRADEEP YELEHANKA RAMACHANDRAMURTHY;CHU SANFORD;HWEI NG CHIT;ZHENG JIA ZHEN;VERMA PURAKH
分类号 H01L23/522;H01L21/02;H01L21/312;H01L21/314;H01L21/316;H01L21/768;H01L21/822;H01L27/04;H01L27/06;H01L27/12;(IPC1-7):H01B13/00 主分类号 H01L23/522
代理机构 代理人
主权项
地址