发明名称 |
Electronic module |
摘要 |
An electronic module has a semiconductor arranged on a substrate. The semiconductor has an electrically conductive contact face on a side remote from the substrate. A contacting unit is configured to be at least partially elastically yielding. A support element is configured to press the contacting unit toward the substrate to make electrical contact. The contacting unit contacts the substrate and/or the contact face.
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申请公布号 |
US2004004820(A1) |
申请公布日期 |
2004.01.08 |
申请号 |
US20030435962 |
申请日期 |
2003.05.12 |
申请人 |
FRISCH MICHAEL;EHLER RALF |
发明人 |
FRISCH MICHAEL;EHLER RALF |
分类号 |
H01L23/48;H01L25/07;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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