| 摘要 |
PURPOSE: A method for cleaning a wafer and an apparatus thereof are provided to be capable of removing particles floated at the surface of a wafer by using diluted HF and an absorbing part instead of a brush. CONSTITUTION: Nitrogen gas is supplied to the surface of a wafer(13) by using pressure. An HF supplying process is carried out at the surface of the wafer. After absorbing particles separated from the wafer, the particles are exhausted. Preferably, a diluted HF is supplied to the wafer while rotating the wafer for firstly separating the particles from the surface of the wafer, before supplying the nitrogen gas. Preferably, a wafer cleaning apparatus(10) is provided with a pressing part(11) for pressing the nitrogen gas to the surface of the wafer(13), an HF supply part(16) for supplying the HF to the surface of the wafer(13), and an exhaust part(15) for exhausting the absorbed particles.
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