| 摘要 |
PURPOSE: A housing of image sensor module is provided to reduce assembling cost of an image senor module. CONSTITUTION: An image sensor module(211,212,216) is inserted into a housing(218) which has a guide groove(218c,218d) and a guide protrusion(218b) formed at the lower part of the housing. The upper part of the housing divided by the guide protrusion(218b) is provided with a lens(217). At the bottom portion of the guide protrusion(218b), the guide groove(218c) is formed such that the width of the guide groove corresponds to that of the image sensor(211). The guide groove(218d) is formed such that its width corresponds to the width of the printed circuit board(212) of the flip chip package.
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