发明名称 LIQUID PRESSURE TYPE CHEMICAL MECHANICAL POLISHING CARRIER APPARATUS
摘要 PURPOSE: A liquid pressure type CMP(Chemical Mechanical Polishing) carrier apparatus is provided to be capable of preventing the increase of pressure at a specific portion of a membrane part. CONSTITUTION: A liquid pressure type CMP carrier apparatus(20) is provided with a cylinder(24) stored with liquid(22) instead of air, installed near a membrane part and a piston inserted into the cylinder for pressing the liquid. Preferably, the liquid is made of one selected from a group consisting of deionized water, IPA, ethanol, and methanol. At this time, these kinds of liquids have a small specific gravity. At the time, the liquids are non-reactive to the membrane part and a wafer. Preferably, a spiral type cylinder or an air pressure type cylinder is used as the cylinder.
申请公布号 KR20040001477(A) 申请公布日期 2004.01.07
申请号 KR20020036693 申请日期 2002.06.28
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE, SE YEONG
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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