| 摘要 |
PURPOSE: A wafer holder of a CMP(Chemical Mechanical Polishing) apparatus is provided to be capable of improving the polishing uniformity of the surface of wafer. CONSTITUTION: A wafer holder of a CMP apparatus includes a coolant(11), a wafer chuck(12), and a fluid. The chuck(12) further includes a fluid path(12a) of the coolant(11) and a back side part(12b) for supporting the rear surface of a wafer(20). The fluid is applied to the back side part(12b) of the chuck(12) in order to adsorb and desorb the wafer. Preferably, water is used as the fluid.
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