The present invention provides a method for manufacturing an integrated circuit using a polishing head in a polishing apparatus. In one advantageous embodiment, the polishing head comprises a wafer carrier having an outer periphery and a wafer holder. The wafer holder is coupled to the wafer carrier and depends from the outer periphery thereof. The wafer holder is configured (i.e., designed) to grip an edge of the semiconductor wafer. <IMAGE> <IMAGE>
申请公布号
EP1147855(A3)
申请公布日期
2004.01.07
申请号
EP20010303616
申请日期
2001.04.20
申请人
AGERE SYSTEMS GUARDIAN CORPORATION
发明人
CREVASSE, ANNETTE M.;EASTER, WILLIAM G.;MAZE, JOHN A.;MICELI, FRANK