| 摘要 |
PURPOSE: A pre-sputtering method for improving utilization rate of a sputter target is provided to increase the utilization rate of the target. CONSTITUTION: A target is placed in a sputtering chamber(41), then plasma ions are introduced into the chamber and an electric potential gradient between the target and a base is formed by applying voltage to drive the plasma ions bombarding the target(42). During the bombardment, an elongated magnet is driven and scan reciprocately at a constant speed on the back side of the target(43) until impurities are removed from the target to complete the pre-sputter of the target(44).
|
