| 摘要 |
PURPOSE: An RTP(Rapid Thermal Processing) equipment is provided to be capable of obtaining uniform temperature distribution total areas of wafer. CONSTITUTION: An RTP equipment comprises a chamber wall(100), the first susceptor(110), the second susceptor(130), an energy dispersion plate(140), and ramps(150). The first susceptor(110) is formed at inner side of the chamber wall(100) for supporting a wafer(120). The second susceptor(130) is formed on the upper of the first susceptor. The energy dispersion plate(140) is formed on the second susceptor. The ramps(150) are formed on the front surface and the rear surface, respectively for rising the temperature of the wafer.
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