| 摘要 |
A means is discussed for electrically interconnecting, cooling and mechanically supporting a multiplicity of heat producing electronic and/or electrical components which is amenable to automated assembly. A structure is identified which consists of one or more fluid-cooled heatsinks; which are in proximate contact with heat producing components and one or more U-shaped spring clips which mechanically force thermal contact between the heat producing components and heatsinks. In turn, each heatsink contains two fluid-filled cavities separated by a common wall, wherein fluid in the first cavity flows in one direction, while fluid in the second cavity flows in the reverse direction. The components are powered by a bus that compensates for the location of the components, providing an equal voltage drop between a power source and each component. The bus is a flat plate that has been stamped to include slots that increase the voltage drop between selected portions of the bus.
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