| 发明名称 |
Circuit board and a method for making the same |
| 摘要 |
A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or "via" 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.
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| 申请公布号 |
US6673723(B2) |
申请公布日期 |
2004.01.06 |
| 申请号 |
US20010815226 |
申请日期 |
2001.03.22 |
| 申请人 |
PATEL BHARAT Z.;BAKER JAY D.;GOENKA LAKHI N.;HOWEY MICHAEL ALLEN;PARUCHURI MOHAN R.;MCMILLAN RICHARD KEITH |
发明人 |
PATEL BHARAT Z.;BAKER JAY D.;GOENKA LAKHI N.;HOWEY MICHAEL ALLEN;PARUCHURI MOHAN R.;MCMILLAN RICHARD KEITH |
| 分类号 |
H05K3/06;H05K3/40;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H01L21/302 |
主分类号 |
H05K3/06 |
| 代理机构 |
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代理人 |
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