发明名称 |
Coplanar integration of lattice-mismatched semiconductor with silicon via wafer boning virtual substrates |
摘要 |
A pigmented curable composition adapted for decorating ceramic substrates (e.g., glass bottles) comprises curable organic binder and solid spherical particles (glass or polymer) having diameters of 10 to 50 microns for facilitating overprinting of additional layers. The preferred embodiment comprises: (a) reactive organic resin component in which epoxy groups comprise the major reactive functionality; (b) amino-functional curing agent; (c) blocked polyisocyanate; and (d) 5 to 35 percent solid spherical particles having diameters of 10 to 50 microns. |
申请公布号 |
AU2003253705(A8) |
申请公布日期 |
2004.01.06 |
申请号 |
AU20030253705 |
申请日期 |
2003.06.25 |
申请人 |
MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
发明人 |
EUGENE A. FITZGERALD;ARTHUR J. PITERA |
分类号 |
H01L21/20;H01L21/762;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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