PURPOSE: A pink LED(Light Emitting Diode) chip and a fabricating method therefor are provided to change the red color beam to the pink color beam by mixing epoxy resin powders with sulfide phosphors and performing a transfer molding process. CONSTITUTION: An LED chip(2) having the wavelength of 430nm to 530nm is adhered on a printed circuit board(1) having a thin film pattern by using a conductive adhesive or a non-conductive adhesive(4). Epoxy resin powders and sulfide phosphors(6) having a red exiting emission characteristic are mixed each other in a predetermined ratio in order to form the mixed powders. A transfer molding process is performed on the printed circuit board(1) including the LED chip(2) by using the mixed powders. The mixed powders are compressed under the pressure of 50-300kg/cm¬2.
申请公布号
KR20040000090(A)
申请公布日期
2004.01.03
申请号
KR20020035218
申请日期
2002.06.24
申请人
SEOUL SEMICONDUCTOR CO., LTD.;YOO, JAE SOO
发明人
CHO, JAE HO;KO, MU SUN;KWAK, HO DONG;LEE, SANG MIN;LIM, DEOK SEUNG;YOO, JAE SOO;YOON, BYEONG HO