METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH METALLIZATION LAYERS INTERCONNECTED BY TUNGSTEN PLUGS,申请号EP20020707058-传众专利搜索

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发明名称	METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH METALLIZATION LAYERS INTERCONNECTED BY TUNGSTEN PLUGS
摘要
申请公布号	EP1374301(A2)	申请公布日期	2004.01.02
申请号	EP20020707058	申请日期	2002.03.15
申请人	KONINKLIJKE PHILIPS ELECTRONICS N.V.	发明人	VAN DE GOOR, ALBERTUS, T., M.
分类号	H01L21/28;H01L21/768;H01L29/417;(IPC1-7):H01L21/768	主分类号	H01L21/28
代理机构		代理人
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