发明名称 Foil printed circuit board and process for manufacturing and mounting the same
摘要 Several electric conductive tracks (2) are located on at least one base support foil (1). The tracks covered by a top layer (3) firmly coupled to the foil (2) and tracks, to form at least one flexible printed circuit with at least one circuit board region (5b). The circuit board region, forms a terminal line, and is connected to one or more other circuit board regions via at least one line in the combination of the support foil and cover layer.
申请公布号 EP1168897(A3) 申请公布日期 2004.01.02
申请号 EP20010112929 申请日期 2001.06.06
申请人 COROPLAST FRITZ MUELLER GMBH & CO. KG 发明人 BLASCHKE, JOERG, DIPL.-PHYS.-ING.
分类号 H05K1/00;H05K1/11;H05K3/00;H05K3/28;H05K3/38 主分类号 H05K1/00
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