发明名称 |
DEVICE AND CONTROL METHOD FOR MICRO WAVE PLASMA PROCESSING |
摘要 |
<p>A microwave is introduced into a process chamber through a waveguide (26) of the plasma process apparatus, thereby generating plasma. A reflection monitor (40) and an electric power monitor (42) monitor the electric power of a reflected wave reflected by the plasma that is generated in the process chamber. Moreover, an incidence monitor (36) and a frequency monitor (48) monitor the frequency of the,microwave generated by a magnetron (24). An electric power supplied to the magnetron (24) is controlled based on the monitored electric power of the reflected wave and the monitored frequency. This method thus controls plasma density to a constant level. <IMAGE></p> |
申请公布号 |
EP1377138(A1) |
申请公布日期 |
2004.01.02 |
申请号 |
EP20020707231 |
申请日期 |
2002.03.28 |
申请人 |
TOKYO ELECTRON LIMITED;OHMI, TADAHIRO |
发明人 |
OHMI, TADAHIRO;HIRAYAMA, MASAKI;SUGAWA, SHIGETOSHI;GOTO, TETSUYA |
分类号 |
H05H1/00;B01J19/08;C23C16/511;C23C16/52;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;H05H1/46;(IPC1-7):H05H1/00 |
主分类号 |
H05H1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|