High temperature resonant integrated microstructure sensor,申请号EP20030077112-传众专利搜索

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发明名称	High temperature resonant integrated microstructure sensor
摘要
申请公布号	EP1365222(A3)	申请公布日期	2004.01.02
申请号	EP20030077112	申请日期	1998.12.07
申请人	HONEYWELL INC.	发明人	YOUNGNER, DANIEL W
分类号	B81B3/00;G01L1/10;G01L1/18;G01L9/00;G01P15/097;G01P15/10;(IPC1-7):G01L9/00	主分类号	B81B3/00
代理机构		代理人
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